Qualcomm, BOE Tie up on Displays Featuring 3D Sonic Sensors
Qualcomm Technologies, Inc. and BOE Technology Group Co., Ltd. have agreed to develop innovative display products featuring Qualcomm 3D Sonic ultrasonic fingerprint sensors. This collaboration is expected to extend from mobile and associated 5G technologies to extended reality (XR) and internet of things (IoT).
Qualcomm Technologies' broad product portfolio combined with BOE's expertise in interface devices and smart IoT systems, makes the partnership an ideal collaboration for the 5G era. Both companies have started working on incorporating value-added and distinctive features to BOE's flexible OLED panels, including the Qualcomm 3D Sonic sensor.
Integrating Qualcomm 3D Sonic sensors into BOE's flexible OLED displays is intended to bring a more streamlined solution, which can enable smartphone OEMs to create unique products using the industry's thinnest and highest security fingerprint solution.
"As a global leader in the semiconductor display industry, BOE has always adhered to the IoT strategy of 'Ecosystem: Open and Connected,' providing global users with excellent intelligent interface devices and solutions. BOE will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensors during the second half of 2020," said Wenbao Gao, Executive Vice President and Chief Executive Officer of Display and Sensor, BOE.
Meanwhile, Roawen Chen, Senior Vice President and Chief Operations Officer at QCT, Qualcomm Technologies said, "Through this collaboration, we expect that OEMs will have more opportunities to design cutting-edge products that feature OLED displays made with the Qualcomm 3D Sonic fingerprint sensor technology. We look forward to further strengthening our innovative collaborations with BOE in key areas like 5G, XR and IoT."